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W29N08GZBIBA

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W29N08GZBIBA

IC FLASH 8GBIT PAR 63VFBGA

Manufacturer: Winbond Electronics

Categories: Memory

Quality Control: Learn More

Winbond Electronics W29N08GZBIBA is an 8 Gigabit NAND Flash memory device, organized as 1G x 8. This component features a 25 ns access time and supports the ONFI interface, ensuring high-speed data transfer for demanding applications. Built using Single-Level Cell (SLC) NAND Flash technology, it offers robust performance and endurance. The device operates within a supply voltage range of 1.7V to 1.95V. Packaged in a 63-VFBGA (9x11) for surface mounting, it is suitable for operation across an industrial temperature range of -40°C to 85°C. Applications for this memory component can be found in automotive, industrial control, and consumer electronics sectors.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 28 week(s)Product Status: ActivePackaging: Tray
Technical Details:
PackagingTray
Package / Case63-VFBGA
Mounting TypeSurface Mount
Memory Size8Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply1.7V ~ 1.95V
TechnologyFLASH - NAND (SLC)
Memory FormatFLASH
Supplier Device Package63-VFBGA (9x11)
Write Cycle Time - Word, Page35ns, 700µs
Memory InterfaceONFI
Access Time25 ns
Memory Organization1G x 8
ProgrammableNot Verified

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.