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W25Q16DVWS

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W25Q16DVWS

IC FLASH 16MBIT SPI/QUAD 104MHZ

Manufacturer: Winbond Electronics

Categories: Memory

Quality Control: Learn More

Winbond Electronics SpiFlash® W25Q16DVWS is a 16Mbit NOR Flash memory device featuring a Quad SPI interface. This non-volatile memory offers a high clock frequency of 104 MHz, enabling rapid data transfer. With an access time of 6 ns, it is suitable for applications requiring quick read operations. The memory organization is 2M x 8 bits. This component supports a supply voltage range of 2.7V to 3.6V. Typical applications for this device include industrial control systems, automotive electronics, and consumer devices. The W25Q16DVWS is supplied in a Tube package.

Additional Information

Series: SpiFlash®RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tube
Technical Details:
PackagingTube
Package / Case-
Mounting Type-
Memory Size16Mbit
Memory TypeNon-Volatile
Operating Temperature-
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NOR
Clock Frequency104 MHz
Memory FormatFLASH
Supplier Device Package-
Write Cycle Time - Word, Page50µs, 3ms
Memory InterfaceSPI - Quad I/O
Access Time6 ns
Memory Organization2M x 8
ProgrammableNot Verified

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.

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