TE0865-02-ABI21MA
MPSOC MODULE WITH ZYNQ ULTRASCALManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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The Trenz Electronic GmbH TE0865-02-ABI21MA is an embedded module featuring the Zynq® UltraScale+™ XCZU11EG-1FFVC1760I System-on-Chip. This module is equipped with 4GB of RAM and 256Mb of flash memory, providing substantial resources for complex processing tasks. Designed for an industrial operating temperature range of 0°C to 85°C, it utilizes Board-to-Board (BTB) socket connectors for seamless integration. Its substantial 100.00mm x 75.00mm footprint accommodates its advanced capabilities. This component is well-suited for applications in the aerospace, defense, industrial automation, and telecommunications sectors, where high-performance processing and robust integration are critical.
Additional Information
Series: Zynq® UltraScale+™RoHS Status: ROHS3 CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | Board-to-Board (BTB) Socket |
| Size / Dimension | 3.937"" L x 2.953"" W (100.00mm x 75.00mm) |
| Speed | - |
| RAM Size | 4GB |
| Operating Temperature | 0°C ~ 85°C |
| Module/Board Type | MPU Core |
| Core Processor | Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I |
| Co-Processor | - |
| Flash Size | 256Mb |
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