TE0823-01-3PIU1F
ICOBOARDManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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The Trenz Electronic GmbH TE0823-01-3PIU1F is an embedded module from the TE0823 series. This module features a Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I SoC, integrating dual-core ARM Cortex-A53 and ARM Cortex-R5 processors. It is equipped with 1GB of RAM and 128Mb of flash memory. The module's compact form factor, measuring 1.970" L x 1.570" W (50.00mm x 40.00mm), is designed for efficient integration into various systems. This component is suitable for applications in industrial automation, medical devices, and telecommunications, operating within an extended temperature range of -40°C to 85°C. The inclusion of a USB connector facilitates interface and debugging.
Additional Information
Series: TE0823RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | USB |
| Size / Dimension | 1.970"" L x 1.570"" W (50.00mm x 40.00mm) |
| Speed | - |
| RAM Size | 1Gb |
| Operating Temperature | -40°C ~ 85°C |
| Module/Board Type | MCU, FPGA |
| Core Processor | ARM Cortex-A53, ARM® Cortex®-R5 |
| Co-Processor | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I |
| Flash Size | 128Mb |
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