TE0813-01-4BE11-A
MODULE MPSOC 4GB DDR4Manufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
Quality Control: Learn More
The Trenz Electronic GmbH TE0813-01-4BE11-A is an embedded module featuring the Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E System-on-Chip. This module provides a robust platform with 2GB of DDR4 RAM and 128Mb of flash memory. Designed for demanding applications, it is suitable for use in industrial automation, medical imaging, and advanced telecommunications. The module utilizes a board-to-board socket connector for integration into larger systems. Its compact form factor, measuring 52.00mm x 76.00mm, facilitates efficient use of board space. The TE0813-01-4BE11-A operates within an industrial temperature range of 0°C to 85°C.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: DiscontinuedPackaging: BoxDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Box |
| Connector Type | Board-to-Board (BTB) Socket |
| Size / Dimension | 2.050"" L x 2.990"" W (52.00mm x 76.00mm) |
| Speed | - |
| RAM Size | 2GB |
| Operating Temperature | 0°C ~ 85°C |
| Module/Board Type | FPGA Core |
| Core Processor | Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E |
| Co-Processor | - |
| Flash Size | 128Mb |
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