TE0808-04-09EG-1EE
IC MODULE ZYNQ USCALE 4GB 128MBManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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The Trenz Electronic GmbH TE0808-04-09EG-1EE is a high-performance embedded module featuring the Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E System-on-Chip. This module integrates a powerful heterogeneous processing system with programmable logic, ideal for demanding applications. It is equipped with 4GB of DDR4 RAM for substantial data handling capabilities and 128Mb of QSPI flash memory for system boot and configuration storage. Designed with a B2B connector interface, it offers robust connectivity for integration into larger systems. The operating temperature range of 0°C to 85°C ensures reliable performance in various environments. This module is commonly utilized in industrial automation, medical imaging, and advanced communication systems. Its compact form factor, measuring 52.00mm x 76.00mm, facilitates integration into space-constrained designs.
Additional Information
Series: TE0808RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | B2B |
| Size / Dimension | 2.050"" L x 2.990"" W (52.00mm x 76.00mm) |
| Speed | - |
| RAM Size | 4GB |
| Operating Temperature | 0°C ~ 85°C |
| Module/Board Type | MPU Core |
| Core Processor | Zynq UltraScale+ XCZU9EG-1FFVC900E |
| Co-Processor | - |
| Flash Size | 128Mb |
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