TE0803-03-3BE11-AS
MODULE SOM TE0803-03Manufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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The Trenz Electronic GmbH TE0803-03-3BE11-AS is a TE0803 series embedded module featuring the Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E System-on-Chip. This module offers 2GB of DDR4 RAM and 128Mb of flash memory for program storage. Designed with a B2B connector interface, it is suitable for applications requiring high-performance processing and flexible I/O. The module operates within a temperature range of 0°C to 85°C. Its compact dimensions of 2.050" L x 2.990" W (52.00mm x 76.00mm) facilitate integration into space-constrained designs. This component is widely utilized in industrial automation, test and measurement, and communications infrastructure.
Additional Information
Series: TE0803RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | B2B |
| Size / Dimension | 2.050"" L x 2.990"" W (52.00mm x 76.00mm) |
| Speed | - |
| RAM Size | 2GB |
| Operating Temperature | 0°C ~ 85°C |
| Module/Board Type | MPU Core |
| Core Processor | Zynq UltraScale+ XCZU3EG-1SFVC784E |
| Co-Processor | - |
| Flash Size | 128Mb |
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