TE0803-03-3AE11-A
IC MODULE ZYNQ USCALE 2GB 128MBManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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The Trenz Electronic GmbH TE0803-03-3AE11-A is an embedded module featuring the Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E SoC. This MPU core module provides 2GB of DDR4 RAM and 128Mb of flash memory, offering a robust platform for complex processing tasks. Designed for operational temperatures between 0°C and 85°C, it utilizes a B2B connector for integration. The module's form factor is 2.050" L x 2.990" W (52.00mm x 76.00mm). This component is well-suited for applications in industrial automation, medical imaging, and high-performance computing where advanced processing capabilities are essential.
Additional Information
Series: TE0803RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | B2B |
| Size / Dimension | 2.050"" L x 2.990"" W (52.00mm x 76.00mm) |
| Speed | - |
| RAM Size | 2GB |
| Operating Temperature | 0°C ~ 85°C |
| Module/Board Type | MPU Core |
| Core Processor | Zynq UltraScale+ XCZU2CG-1SFVC784E |
| Co-Processor | - |
| Flash Size | 128Mb |
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