TE0729-02-62I63MAK
IC SOC MODULE ZYNQManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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Trenz Electronic GmbH TE0729-02-62I63MAK is an embedded module featuring the Xilinx Zynq-7000 (Z-7020) System-on-Chip (SoC). This module integrates an ARM Cortex-A9 dual-core processor with a programmable logic array, providing a versatile platform for complex embedded applications. It is equipped with 512MB of DDR3 RAM for substantial data handling and 32MB of QSPI Flash memory for program storage. Designed for robustness, it operates across an industrial temperature range of -40°C to 85°C. The module utilizes a B2B connector for system integration and measures 2.050 inches by 2.990 inches (52.00mm x 76.00mm). This component is commonly found in industrial automation, medical imaging, and aerospace and defense systems.
Additional Information
Series: TE0729RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: DiscontinuedPackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | B2B |
| Size / Dimension | 2.050"" L x 2.990"" W (52.00mm x 76.00mm) |
| Speed | - |
| RAM Size | 512MB |
| Operating Temperature | -40°C ~ 85°C |
| Module/Board Type | MCU, FPGA |
| Core Processor | ARM Cortex-A9 |
| Co-Processor | Zynq-7000 (Z-7020) |
| Flash Size | 32MB |
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