TE0729-02-62I63FAK
IC SOC MODULE ZYNQManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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Trenz Electronic GmbH TE0729-02-62I63FAK is an embedded Zynq-7000 SoC module featuring a dual-core ARM Cortex-A9 processor. This module integrates 512MB of DDR3 RAM and 32MB of QSPI flash memory, offering substantial processing and storage capabilities. Designed for demanding applications, it operates within an industrial temperature range of -40°C to 85°C. The TE0729-02-62I63FAK is built for high-volume production, utilizing a B2B connector for system integration. Its compact form factor, measuring 52.00mm x 76.00mm, makes it suitable for space-constrained designs across industries such as industrial automation, automotive, and communications.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: DiscontinuedPackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | B2B |
| Size / Dimension | 2.050"" L x 2.990"" W (52.00mm x 76.00mm) |
| Speed | - |
| RAM Size | 512MB |
| Operating Temperature | -40°C ~ 85°C |
| Module/Board Type | MCU, FPGA |
| Core Processor | ARM Cortex-A9 |
| Co-Processor | Zynq-7000 (Z-7020) |
| Flash Size | 32MB |
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