TE0729-02-62I63FA
IC SOC MODULE ZYNQManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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Trenz Electronic GmbH TE0729-02-62I63FA is an embedded system-on-chip (SoC) module featuring the Xilinx Zynq-7000 (Z-7020) co-processor. This module integrates an ARM Cortex-A9 core processor with a Xilinx 7-series FPGA fabric, offering a powerful heterogeneous processing platform. It is equipped with 512MB of DDR3 RAM and 32MB of QSPI flash memory for program storage. Designed for industrial applications, the TE0729-02-62I63FA operates within an extended temperature range of -40°C to 85°C. The module utilizes a B2B connector for interfacing and is supplied in bulk packaging. Its compact form factor, measuring 2.050" x 2.990" (52.00mm x 76.00mm), makes it suitable for integration into various embedded systems, including industrial automation, medical devices, and advanced driver-assistance systems (ADAS).
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: DiscontinuedPackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | B2B |
| Size / Dimension | 2.050"" L x 2.990"" W (52.00mm x 76.00mm) |
| Speed | - |
| RAM Size | 512MB |
| Operating Temperature | -40°C ~ 85°C |
| Module/Board Type | MCU, FPGA |
| Core Processor | ARM Cortex-A9 |
| Co-Processor | Zynq-7000 (Z-7020) |
| Flash Size | 32MB |
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