TE0720-04-62I33ML
IC SOC MODULE XILINX ZYNQManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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Trenz Electronic GmbH TE0720-04-62I33ML is an embedded System-on-Chip (SoC) module featuring Xilinx Zynq technology. This module integrates an ARM Cortex-A9 dual-core processor with Xilinx 7-series FPGA fabric, offering a powerful platform for complex embedded applications. It is equipped with 1GB of DDR3 RAM and 32MB of SPI NOR flash memory for program storage. The TE0720-04-62I33ML includes an Ethernet interface and utilizes a board-to-board socket connector for system integration. Designed for industrial environments, it operates across a temperature range of -40°C to 85°C. This module is commonly employed in industrial automation, test and measurement equipment, and high-performance computing applications.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | Board-to-Board (BTB) Socket |
| Size / Dimension | 1.970"" L x 1.570"" W (50.00mm x 40.00mm) |
| Speed | - |
| RAM Size | 1Gb |
| Operating Temperature | -40°C ~ 85°C |
| Module/Board Type | Ethernet Core |
| Core Processor | ARM® Cortex®-A9 |
| Co-Processor | - |
| Flash Size | 32MB |
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