TE0720-04-62I33MA
IC SOC MODULE XILINX ZYNQManufacturer: Trenz Electronic GmbH
Categories: Microcontrollers, Microprocessor, FPGA Modules
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Trenz Electronic GmbH TE0720-04-62I33MA is an embedded system-on-chip (SoC) module featuring a Xilinx Zynq architecture with an ARM Cortex-A9 core. This module integrates 1GB of DDR3 RAM and 32MB of flash memory, providing substantial processing and storage capabilities for demanding applications. The TE0720-04-62I33MA is designed for robust operation within an industrial temperature range of -40°C to 85°C. Its compact form factor, measuring 1.970" x 1.570" (50.00mm x 40.00mm), and its reliance on board-to-board socket connectors facilitate efficient integration into custom hardware designs. This component is commonly utilized in industrial automation, embedded vision systems, and high-performance computing applications where a powerful, flexible processing solution is required.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | Board-to-Board (BTB) Socket |
| Size / Dimension | 1.970"" L x 1.570"" W (50.00mm x 40.00mm) |
| Speed | - |
| RAM Size | 1Gb |
| Operating Temperature | -40°C ~ 85°C |
| Module/Board Type | Ethernet Core |
| Core Processor | ARM® Cortex®-A9 |
| Co-Processor | - |
| Flash Size | 32MB |
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