

Manufacturer: Texas Instruments
Categories: System On Chip (SoC)
Quality Control: Learn More
| Packaging | Tray |
| Package / Case | 760-BFBGA, FCBGA |
| Speed | 500MHz |
| RAM Size | 2.5MB |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Core Processor | ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x |
| Primary Attributes | - |
| Connectivity | CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB |
| Peripherals | DMA, POR, PWM, WDT |
| Supplier Device Package | 760-FCBGA (23x23) |
| Architecture | DSP, MPU |
| Flash Size | - |