XAM5749ABZXEA
SoC, CMOS, PBGA760Manufacturer: Texas Instruments
Categories: Microprocessors
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Texas Instruments AM5749 System-on-Chip (SoC), part number XAM5749ABZXEA, is a CMOS device featuring a 760-terminal S-PBGA package. This low-profile, fine-pitch LFBGA package has a square shape with solder balls on the bottom and a terminal pitch of 0.800 mm. The SoC operates within a temperature range of -40°C to 105°C and utilizes a supply voltage between 1.11V and 1.20V, with a nominal value of 1.15V. Fabricated using CMOS technology, this surface-mount component is designed for high-performance applications across industrial automation, vision systems, and embedded computing. The package body material is plastic/epoxy, with dimensions of 23.00 x 23.00 mm and a maximum seated height of 1.630 mm.
Additional Information
Series: AM5749RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 23.0000 |
| Width | 23.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B760 |
| Number_of_Terminals | 760 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Equivalence_Code | BGA760,28X28,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Seated_Height_Max | 1.6300 |
| Supply_Voltage_Max | 1.2000 |
| Supply_Voltage_Min | 1.1100 |
| Supply_Voltage_Nom | 1.1500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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