XAM5746ABZXEA
SoC, CMOS, PBGA760Manufacturer: Texas Instruments
Categories: Microprocessors
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The Texas Instruments AM5746 is a 760-terminal, CMOS System-on-Chip (SoC) in a square, low-profile, fine-pitch ball grid array (PBGA) package. This device operates within a temperature range of -40°C to 105°C and features a nominal supply voltage of 1.15V, with a minimum of 1.11V and a maximum of 1.20V. The PBGA760 package, with a terminal pitch of 0.800mm, is designed for surface mounting. Applications for this component include industrial automation, digital signage, and advanced driver-assistance systems (ADAS). The XAM5746ABZXEA utilizes a plastic/epoxy package body material.
Additional Information
Series: AM5746RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 23.0000 |
| Width | 23.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B760 |
| Number_of_Terminals | 760 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Equivalence_Code | BGA760,28X28,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Seated_Height_Max | 1.6300 |
| Supply_Voltage_Max | 1.2000 |
| Supply_Voltage_Min | 1.1100 |
| Supply_Voltage_Nom | 1.1500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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