XAM5718AABCXEA
SoC, CMOS, PBGA760Manufacturer: Texas Instruments
Categories: Microprocessors
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Texas Instruments AM5718 is a highly integrated System-on-Chip (SoC) solution built on CMOS technology. This component, designated as XAM5718AABCXEA, features a 760-terminal PBGA package (JESD_30 Code: S-PBGA-B760) with a fine pitch of 0.80mm, presented in a square grid array configuration. Its operational temperature range spans from -40°C to +105°C, with a nominal supply voltage of 1.15V, ranging from 1.11V to 1.20V. The plastic/epoxy package has a maximum seated height of 2.96mm. This versatile SoC is well-suited for demanding applications across industrial automation, advanced driver-assistance systems (ADAS), and high-performance embedded computing.
Additional Information
Series: AM5718RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 23.0000 |
| Width | 23.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B760 |
| Number_of_Terminals | 760 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA760,28X28,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 2.9600 |
| Supply_Voltage_Max | 1.2000 |
| Supply_Voltage_Min | 1.1100 |
| Supply_Voltage_Nom | 1.1500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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