XAM5706ACBDJEA
SoC, CMOS, PBGA538Manufacturer: Texas Instruments
Categories: Microprocessors
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Texas Instruments AM5706 Series System-on-Chip (SoC), part number XAM5706ACBDJEA. This CMOS SoC features a 538-terminal Ball Grid Array (BGA) package with a fine pitch of 0.650 mm. Operating within a temperature range of -40°C to +105°C, it supports a nominal supply voltage of 1.15V, with a minimum of 1.11V and a maximum of 1.20V. The component is designed for surface mounting, utilizing a low-profile, square grid array package. Applications for this device are found in industrial automation, communications infrastructure, and advanced driver-assistance systems (ADAS).
Additional Information
Series: AM5706RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 17.0000 |
| Technology | CMOS |
| Length | 17.0000 |
| JESD_30_Code | S-PBGA-B538 |
| Number_of_Terminals | 538 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Equivalence_Code | BGA538,25X25,25 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Seated_Height_Max | 1.2980 |
| Supply_Voltage_Max | 1.2000 |
| Supply_Voltage_Min | 1.1100 |
| Supply_Voltage_Nom | 1.1500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.650 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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