V62/15602-01XF
SoC, CMOS, PBGA324Manufacturer: Texas Instruments
Categories: Microprocessors
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Texas Instruments AM3358 Series System-on-Chip (SoC) in a 324-ball S-PBGA package (JESD_30 Code: S-PBGA-B324). This CMOS SoC features a 0.800mm terminal pitch and a low-profile, fine-pitch grid array package measuring 15.00mm x 15.00mm with a seated height of 1.40mm. It operates within a temperature range of -40°C to 105°C and requires a supply voltage between 1.056V and 1.144V, with a nominal voltage of 1.100V. The plastic/epoxy body material ensures robust performance. This component is designed for surface mounting and is utilized across various industrial applications, including industrial automation, human-machine interfaces (HMIs), and smart grid infrastructure.
Additional Information
Series: AM3358RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Width | 15.0000 |
| Technology | CMOS |
| Length | 15.0000 |
| JESD_30_Code | S-PBGA-B324 |
| Number_of_Terminals | 324 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Equivalence_Code | BGA324,18X18,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Seated_Height_Max | 1.4000 |
| Supply_Voltage_Max | 1.1440 |
| Supply_Voltage_Min | 1.0560 |
| Supply_Voltage_Nom | 1.1000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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