AM5708ACBDJEA
SoC, CMOS, PBGA538Manufacturer: Texas Instruments
Categories: Microprocessors
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Texas Instruments AM5708 System-on-Chip (SoC) from the AM5708 series. This CMOS-based component is housed in a 538-ball PBGA (Plastic Ball Grid Array) package with a 0.65mm terminal pitch, measuring 17mm x 17mm with a maximum seated height of 1.253mm. It operates within a temperature range of -40°C to 105°C and requires a supply voltage between 1.11V and 1.20V, with a nominal value of 1.15V. The AM5708ACBDJEA is designed for advanced embedded processing applications across various industries, including industrial automation, automotive, and communication infrastructure. Its low-profile, fine-pitch grid array package is suitable for high-density surface-mount designs.
Additional Information
Series: AM5708RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 17.0000 |
| Width | 17.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B538 |
| Number_of_Terminals | 538 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Equivalence_Code | BGA538,25X25,25 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Seated_Height_Max | 1.2530 |
| Supply_Voltage_Max | 1.2000 |
| Supply_Voltage_Min | 1.1100 |
| Supply_Voltage_Nom | 1.1500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.650 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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