AM3874CCYEA100
SoC, CMOS, PBGA684Manufacturer: Texas Instruments
Categories: Microprocessors
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Texas Instruments AM3874 series System-on-Chip (SoC), part number AM3874CCYEA100. This CMOS device features a 684-ball Fine-Pitch Ball Grid Array (FBGA) package with a terminal pitch of 0.800mm, a seated height of 3.06mm, and a body size of 23x23mm. Operating across a temperature range of -40°C to +105°C, it utilizes a nominal supply voltage of 1.35V. This surface-mount component is constructed with plastic/epoxy molding compound and is suitable for high-performance applications within the industrial, automotive, and consumer electronics sectors.
Additional Information
Series: AM3874RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 23.0000 |
| Width | 23.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B684 |
| Number_of_Terminals | 684 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA684,28X28,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.0600 |
| Supply_Voltage_Nom | 1.3500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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