TMS320TCI6614XCMSA2
SoC, CMOS, PBGA900Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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Texas Instruments TMS320TCI6614XCMSA2 is a CMOS System on Chip (SoC) housed in a 900-ball Fine Pitch Ball Grid Array (FBGA) package. This device, part of the TMS320TCI6614 series, features a square package body with dimensions of 25.00mm x 25.00mm and a maximum seated height of 3.39mm. The terminal pitch is 0.800mm, with ball terminals positioned on the bottom. Manufactured with CMOS technology, the TMS320TCI6614XCMSA2 is designed for high-performance processing applications. This component finds utility in sectors such as telecommunications, industrial automation, and advanced audio processing.
Additional Information
Series: TMS320TCI6614RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 25.0000 |
| Width | 25.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B900 |
| Number_of_Terminals | 900 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.3900 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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