TMS320TCI6614XCMSA
SoC, CMOS, PBGA900Manufacturer: Texas Instruments
Categories: Digital Signal Processors
Quality Control: Learn More
Texas Instruments TMS320TCI6614 series System-on-Chip (SoC) is a high-performance device designed for demanding applications. This CMOS-based SoC features a 900-ball Fine-Pitch Ball Grid Array (FBGA) package, specifically a S-PBGA-B900 footprint, with a terminal pitch of 0.800 mm. The square package measures 25.00 mm by 25.00 mm with a maximum seated height of 3.39 mm. Its architecture is optimized for digital signal processing tasks, making it suitable for use in telecommunications infrastructure, industrial automation, and advanced audio/video processing systems. The TMS320TCI6614XCMSA leverages advanced CMOS technology for efficient operation and robust signal handling.
Additional Information
Series: TMS320TCI6614RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 25.0000 |
| Width | 25.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B900 |
| Number_of_Terminals | 900 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.3900 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
Request a Quote
Clients Also Buy
TMS320TCI6614CMS2
SoC, CMOS, PBGA900
TMS320TCI6614CMSA
SoC, CMOS, PBGA900
TMS320TCI6614CMSA2
SoC, CMOS, PBGA900