TMS320TCI6614CMSA2
SoC, CMOS, PBGA900Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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Texas Instruments TMS320TCI6614CMSA2 is a high-performance CMOS System-on-Chip (SoC) designed for demanding signal processing applications. This device, part of the TMS320TCI6614 series, features a 900-ball Plastic Ball Grid Array (PBGA) package with a terminal pitch of 0.800 mm, offering a compact footprint suitable for space-constrained designs. Its square package shape and fine pitch grid array style facilitate efficient board layout. The SoC integrates advanced processing capabilities for complex algorithms, making it ideal for use in telecommunications infrastructure, industrial automation, and high-performance embedded systems. The FBGA package ensures robust surface mount connectivity.
Additional Information
Series: TMS320TCI6614RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 25.0000 |
| Width | 25.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B900 |
| Number_of_Terminals | 900 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.3900 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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