TMS320TCI6614CMS2
SoC, CMOS, PBGA900Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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Texas Instruments TMS320TCI6614CMS2 is a System-on-Chip (SoC) utilizing advanced CMOS technology. This device, part of the TMS320TCI6614 series, is housed in a 900-ball Plastic Ball Grid Array (PBGA) package, specifically an S-PBGA-B900 with a terminal pitch of 0.800 mm. The square package measures 25.00 mm by 25.00 mm with a maximum seated height of 3.39 mm. Designed for high-performance digital signal processing applications, this SoC finds utility in wireless infrastructure, industrial automation, and advanced audio processing systems. Its extensive 900-terminal count facilitates complex interconnections required for demanding embedded system designs.
Additional Information
Series: TMS320TCI6614RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 25.0000 |
| Width | 25.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B900 |
| Number_of_Terminals | 900 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.3900 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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