TMS320TCI6612XCMSA2
SoC, CMOS, PBGA900Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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The Texas Instruments TMS320TCI6612XCMSA2 is a high-performance CMOS System-on-Chip (SoC) designed for demanding applications. This component, part of the TMS320TCI6612 series, features a 900-ball Grid Array package (S-PBGA-B900) with bottom-positioned solder balls, facilitating efficient surface mounting. Operating with a nominal supply voltage of 1.00V, it supports a range from 0.95V to 1.05V. Its BGA package, constructed from plastic/epoxy, offers a square form factor. This device is suitable for deployment in telecommunications infrastructure, industrial automation, and advanced signal processing systems, leveraging its robust architecture for complex data manipulation and control.
Additional Information
Series: TMS320TCI6612RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B900 |
| Number_of_Terminals | 900 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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