TMS320TCI6608XCYPA
SoC, CMOS, PBGA841Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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Texas Instruments TMS320TCI6608 SoC, a CMOS device, is presented in an 841-ball PBGA package (S-PBGA-B841). This square, fine-pitch grid array component features bottom-mounted ball terminals with a 0.800mm pitch and a maximum seated height of 3.3900mm. Built on advanced CMOS technology, this system-on-chip is designed for high-performance embedded processing applications. It is commonly utilized in industries such as telecommunications, industrial automation, and automotive systems. The TMS320TCI6608 series is recognized for its robust processing capabilities within demanding electronic designs.
Additional Information
Series: TMS320TCI6608RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 24.0000 |
| Width | 24.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B841 |
| Number_of_Terminals | 841 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.3900 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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