TMS320TCI6608CYPA25
SoC, CMOS, PBGA841Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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Texas Instruments TMS320TCI6608 System-on-Chip (SoC) in a PBGA841 package. This CMOS device, part of the TMS320TCI6608 series, features 841 terminals arranged in a square, fine-pitch grid array with a 0.800mm pitch. The FBGA package has a body width and length of 24.0000mm and a maximum seated height of 3.3900mm. Designed for high-performance applications, this SoC is suitable for use in telecommunications infrastructure, industrial automation, and advanced signal processing systems. Its ball terminals are positioned at the bottom, and it utilizes surface-mount technology.
Additional Information
Series: TMS320TCI6608RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 24.0000 |
| Width | 24.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B841 |
| Number_of_Terminals | 841 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.3900 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |