TMS320TCI6608CYPA
SoC, CMOS, PBGA841Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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Texas Instruments TMS320TCI6608CYPA is a CMOS System-on-Chip (SoC) housed in an 841-ball Fine-Pitch Ball Grid Array (FBGA) package. This component, part of the TMS320TCI6608 series, features a square package with a body size of 24.00mm x 24.00mm and a maximum seated height of 3.39mm. The ball terminals, with a pitch of 0.80mm, are located on the bottom of the package. Designed for demanding applications, this SoC is engineered for high-performance processing. It finds utility in industries such as telecommunications, industrial automation, and medical imaging, where advanced signal processing capabilities are critical.
Additional Information
Series: TMS320TCI6608RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 24.0000 |
| Width | 24.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B841 |
| Number_of_Terminals | 841 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.3900 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |