TMS320C6670XCYP2
SoC, CMOS, PBGA841Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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Texas Instruments TMS320C6670 SoC, part number TMS320C6670XCYP2, is a high-performance, CMOS-based System-on-Chip designed for demanding applications. This component features an 841-ball Fine Pitch Ball Grid Array (FBGA) package with a 0.800 mm terminal pitch, measuring 24.000 mm by 24.000 mm with a maximum seated height of 3.3900 mm. It operates within a supply voltage range of 0.9500V to 1.0500V, with a nominal voltage of 1.0000V. The TMS320C6670 series is widely utilized in telecommunications infrastructure, radar and imaging systems, industrial automation, and high-performance computing. This surface-mount device utilizes plastic/epoxy for its package body material.
Additional Information
Series: TMS320C6670RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 24.0000 |
| Width | 24.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B841 |
| Number_of_Terminals | 841 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.3900 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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