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TMS320C6670XCYP2

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TMS320C6670XCYP2

SoC, CMOS, PBGA841

Manufacturer: Texas Instruments

Categories: Digital Signal Processors

Quality Control: Learn More

Texas Instruments TMS320C6670 SoC, part number TMS320C6670XCYP2, is a high-performance, CMOS-based System-on-Chip designed for demanding applications. This component features an 841-ball Fine Pitch Ball Grid Array (FBGA) package with a 0.800 mm terminal pitch, measuring 24.000 mm by 24.000 mm with a maximum seated height of 3.3900 mm. It operates within a supply voltage range of 0.9500V to 1.0500V, with a nominal voltage of 1.0000V. The TMS320C6670 series is widely utilized in telecommunications infrastructure, radar and imaging systems, industrial automation, and high-performance computing. This surface-mount device utilizes plastic/epoxy for its package body material.

Additional Information

Series: TMS320C6670RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:
Technical Details:
Length24.0000
Width24.0000
TechnologyCMOS
JESD_30_CodeS-PBGA-B841
Number_of_Terminals841
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeFBGA
Package_ShapeSquare
Package_StyleGRID ARRAY, FINE PITCH
Seated_Height_Max3.3900
Supply_Voltage_Max1.0500
Supply_Voltage_Min0.9500
Supply_Voltage_Nom1.0000
Surface_MountYes
Terminal_FormBall
Terminal_Pitch0.800
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeSoC

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