TMS302C6203BGLS173H
Mixed Signal Processor, 32-Bit Size, 32-Ext Bit, 300MHz, CMOS, PBGA384Manufacturer: Texas Instruments
Categories: Digital Signal Processors
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Texas Instruments TMS302C6203BGLS173H is a 32-bit mixed-signal processor from the TMS302 series. This CMOS device operates at a maximum clock frequency of 300MHz and features a 32-bit external data bus. It includes 524,288 words of RAM and supports low-power modes. The processor is housed in a 384-ball grid array (BGA) package with a terminal pitch of 0.80mm, suitable for surface mounting. It boasts boundary scan capabilities. This component is utilized in applications such as telecommunications, industrial automation, and signal processing systems demanding high computational throughput. The operating temperature range is from 0°C to 90°C, with a nominal supply voltage of 1.20V.
Additional Information
Series: TMS302RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Format | Fixed Point |
| Length | 18.0000 |
| Width | 18.0000 |
| Technology | CMOS |
| Address_Bus_Width | 22 |
| Barrel_Shifter | No |
| Bit_Size | 32 |
| Boundary_Scan | Yes |
| Clock_Frequency_Max | 300.0000000000000000 |
| External_Data_Bus_Width | 32 |
| Internal_Bus_Architecture | Multiple |
| JESD_30_Code | S-PBGA-B384 |
| Low_Power_Mode | Yes |
| Number_of_Terminals | 384 |
| Operating_Temperature_Max | 90.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA384,22X22,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| RAM_words | 524288 |
| Seated_Height_Max | 2.8000 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | DIGITAL SIGNAL PROCESSOR, MIXED |
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