120771-1
CONN HEADER DUAL BEAM 60POS PCBManufacturer: TE Connectivity AMP Connectors
Categories: Specialized
Quality Control: Learn More
TE Connectivity AMP Connectors Z-PACK HS3 Series header, part number 120771-1, is a 60-position, dual beam connector designed for backplane applications. This male header features through-hole mounting with a 0.098" (2.50mm) pitch. The contacts are finished with 30.0µin (0.76µm) gold plating for enhanced conductivity and durability. With 6 rows and 10 columns, this component offers robust connectivity. It is suitable for high-speed signal transmission and finds application in telecommunications and computing industries. The connector is supplied in tube packaging.
Additional Information
Series: Z-PACK HS3RoHS Status: RoHS Compliant By ExemptionManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | - |
| Packaging | Tube |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold |
| Color | - |
| Mounting Type | Through Hole |
| Number of Positions | 60 |
| Pitch | 0.098"" (2.50mm) |
| Number of Rows | 6 |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | Dual Beam, Center |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | - |
| Number of Columns | 10 |
Request a Quote
Clients Also Buy
120662-2
CONN HEADER DUAL BEAM 50POS PCB
120663-1
CONN SHROUD 100POS PCB
120681-2
CONN HEADER DUAL BEAM 30POS PCB