120742-1
CONN HEADER DUAL BEAM 30POS PCBManufacturer: TE Connectivity AMP Connectors
Categories: Specialized
Quality Control: Learn More
TE Connectivity AMP Connectors Z-PACK HS3 series header, part number 120742-1, is a 30-position dual beam connector designed for PCB backplane applications. This through-hole mounted header features male pins and blades with a gold contact finish, 30.0µin (0.76µm) thick. The 2.50mm pitch and dual beam, center connector style ensure robust connectivity. With 6 rows and 5 columns, all 30 positions are loaded. This component is typically utilized in high-speed telecommunications and computing systems. The part is supplied in tube packaging and features a press-fit termination.
Additional Information
Series: Z-PACK HS3RoHS Status: RoHS Compliant By ExemptionManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | - |
| Packaging | Tube |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold |
| Color | - |
| Mounting Type | Through Hole |
| Number of Positions | 30 |
| Pitch | 0.098"" (2.50mm) |
| Number of Rows | 6 |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | Dual Beam, Center |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | - |
| Number of Columns | 5 |
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