832-AG11D
CONN IC DIP SOCKET 32POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
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TE Connectivity AMP Connectors 800 Series 832-AG11D is a 32-position dual in-line package (DIP) socket designed for through-hole mounting. This open-frame socket features a 0.100" (2.54mm) pitch for both mating and post connections, with a row spacing of 0.6" (15.24mm). The contact material is copper alloy, with gold plating on the mating contacts offering a thickness of 25.0µin (0.63µm) for enhanced conductivity and durability. The post contacts are tin-lead finished. Operating within a temperature range of -55°C to 105°C, this component is suitable for applications in industrial automation, data communication, and consumer electronics. The housing is constructed from durable polyester.
Additional Information
Series: 800RoHS Status: RoHS Compliant By ExemptionManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | Open Frame |
| Packaging | Tube |
| Mounting Type | Through Hole |
| Type | DIP, 0.6"" (15.24mm) Row Spacing |
| Operating Temperature | -55°C ~ 105°C |
| Number of Positions or Pins (Grid) | 32 (2 x 16) |
| Termination | Solder |
| Housing Material | Polyester |
| Pitch - Mating | 0.100"" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 25.0µin (0.63µm) |
| Contact Material - Mating | Copper Alloy |
| Pitch - Post | 0.100"" (2.54mm) |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | Copper Alloy |
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