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832-AG11D

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832-AG11D

CONN IC DIP SOCKET 32POS GOLD

Manufacturer: TE Connectivity AMP Connectors

Categories: IC Sockets

Quality Control: Learn More

TE Connectivity AMP Connectors 800 Series 832-AG11D is a 32-position dual in-line package (DIP) socket designed for through-hole mounting. This open-frame socket features a 0.100" (2.54mm) pitch for both mating and post connections, with a row spacing of 0.6" (15.24mm). The contact material is copper alloy, with gold plating on the mating contacts offering a thickness of 25.0µin (0.63µm) for enhanced conductivity and durability. The post contacts are tin-lead finished. Operating within a temperature range of -55°C to 105°C, this component is suitable for applications in industrial automation, data communication, and consumer electronics. The housing is constructed from durable polyester.

Additional Information

Series: 800RoHS Status: RoHS Compliant By ExemptionManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:
Technical Details:
FeaturesOpen Frame
PackagingTube
Mounting TypeThrough Hole
TypeDIP, 0.6"" (15.24mm) Row Spacing
Operating Temperature-55°C ~ 105°C
Number of Positions or Pins (Grid)32 (2 x 16)
TerminationSolder
Housing MaterialPolyester
Pitch - Mating0.100"" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating25.0µin (0.63µm)
Contact Material - MatingCopper Alloy
Pitch - Post0.100"" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post-
Contact Material - PostCopper Alloy

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