820-AG10D
CONN IC DIP SOCKET 20POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
Quality Control: Learn More
TE Connectivity AMP Connectors 800 series DIP socket, part number 820-AG10D, offers a 20-position (2 x 10) configuration with a 0.3" (7.62mm) row spacing. This through-hole socket features an open frame design and is constructed with a polyester housing. The contact material for mating is a copper alloy with a gold contact finish, specified at a 25.0µin (0.63µm) thickness. Ideal for applications in the industrial and telecommunications sectors, this component is supplied in tube packaging and operates across a temperature range of -55°C to 105°C. The pitch for both mating and post connections is 0.100" (2.54mm), with solder termination.
Additional Information
Series: 800RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | Open Frame |
| Packaging | Tube |
| Mounting Type | Through Hole |
| Type | DIP, 0.3"" (7.62mm) Row Spacing |
| Operating Temperature | -55°C ~ 105°C |
| Number of Positions or Pins (Grid) | 20 (2 x 10) |
| Termination | Solder |
| Housing Material | Polyester |
| Pitch - Mating | 0.100"" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 25.0µin (0.63µm) |
| Contact Material - Mating | Copper Alloy |
| Pitch - Post | 0.100"" (2.54mm) |
| Contact Finish - Post | - |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | - |
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