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814-AG11D-ES

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814-AG11D-ES

CONN IC DIP SOCKET 14POS GOLD

Manufacturer: TE Connectivity AMP Connectors

Categories: IC Sockets

Quality Control: Learn More

TE Connectivity AMP Connectors 800 Series DIP socket, part number 814-AG11D-ES, provides a 14-position (2 x 7) connection with a 0.3" (7.62mm) row spacing. This through-hole mounted component features copper alloy contacts with a mating finish of gold at 25.0µin (0.63µm) and post finish of tin-lead at 80.0µin (2.03µm). The polyester housing material and open-frame design are suitable for demanding applications. Operating within a temperature range of -55°C to 105°C, this socket utilizes 0.100" (2.54mm) pitch for both mating and post connections, terminating via solder. Industries relying on robust interconnect solutions, such as industrial automation and telecommunications, frequently utilize this type of component for reliable component mounting and testing. Packaged in a tube.

Additional Information

Series: 800RoHS Status: RoHS Compliant By ExemptionManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:
Technical Details:
FeaturesOpen Frame
PackagingTube
Mounting TypeThrough Hole
TypeDIP, 0.3"" (7.62mm) Row Spacing
Operating Temperature-55°C ~ 105°C
Number of Positions or Pins (Grid)14 (2 x 7)
TerminationSolder
Housing MaterialPolyester
Pitch - Mating0.100"" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating25.0µin (0.63µm)
Contact Material - MatingCopper Alloy
Pitch - Post0.100"" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post80.0µin (2.03µm)
Contact Material - PostCopper Alloy

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As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.