808-AG11D-ES-LF
CONN IC DIP SOCKET 8POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
Quality Control: Learn More
TE Connectivity AMP Connectors 800 Series 808-AG11D-ES-LF is an 8-position dual in-line package (DIP) socket designed for through-hole mounting. This socket features a 0.3" (7.62mm) row spacing and a 0.100" (2.54mm) pitch. The contact material is Beryllium Copper for mating and Copper for the post, both finished with 20.0µin (0.51µm) of gold. Its open frame design and Polycyclohexylenedimethylene Terephthalate (PCT), Polyester housing contribute to its reliability in applications such as industrial automation and telecommunications. The component operates within a temperature range of -55°C to 105°C and is supplied in tube packaging.
Additional Information
Series: 800RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | Open Frame |
| Packaging | Tube |
| Mounting Type | Through Hole |
| Type | DIP, 0.3"" (7.62mm) Row Spacing |
| Operating Temperature | -55°C ~ 105°C |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Termination | Solder |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Pitch - Mating | 0.100"" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100"" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 20.0µin (0.51µm) |
| Contact Material - Post | Copper |
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