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808-AG11D-ES-LF

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808-AG11D-ES-LF

CONN IC DIP SOCKET 8POS GOLD

Manufacturer: TE Connectivity AMP Connectors

Categories: IC Sockets

Quality Control: Learn More

TE Connectivity AMP Connectors 800 Series 808-AG11D-ES-LF is an 8-position dual in-line package (DIP) socket designed for through-hole mounting. This socket features a 0.3" (7.62mm) row spacing and a 0.100" (2.54mm) pitch. The contact material is Beryllium Copper for mating and Copper for the post, both finished with 20.0µin (0.51µm) of gold. Its open frame design and Polycyclohexylenedimethylene Terephthalate (PCT), Polyester housing contribute to its reliability in applications such as industrial automation and telecommunications. The component operates within a temperature range of -55°C to 105°C and is supplied in tube packaging.

Additional Information

Series: 800RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:
Technical Details:
FeaturesOpen Frame
PackagingTube
Mounting TypeThrough Hole
TypeDIP, 0.3"" (7.62mm) Row Spacing
Operating Temperature-55°C ~ 105°C
Number of Positions or Pins (Grid)8 (2 x 4)
TerminationSolder
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating0.100"" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating20.0µin (0.51µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100"" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post20.0µin (0.51µm)
Contact Material - PostCopper

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Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.

Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.