524-AG11D-ESL
CONN IC DIP SOCKET 24POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
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TE Connectivity AMP Connectors 500 Series DIP socket, part number 524-AG11D-ESL. This 24-position socket features a 0.100" (2.54mm) pitch and a 0.6" (15.24mm) row spacing. It utilizes Beryllium Copper contacts with a 5.00µin (0.127µm) gold mating finish for reliable performance. The closed frame design and through-hole mounting facilitate robust PCB integration. This component is suitable for applications in industrial automation, telecommunications, and consumer electronics, operating within a temperature range of -55°C to 125°C. Packaged in a tube, it is designed for solder termination.
Additional Information
Series: 500RoHS Status: RoHS Compliant By ExemptionManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | Closed Frame |
| Packaging | Tube |
| Mounting Type | Through Hole |
| Type | DIP, 0.6"" (15.24mm) Row Spacing |
| Operating Temperature | -55°C ~ 125°C |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Termination | Solder |
| Housing Material | - |
| Pitch - Mating | 0.100"" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 5.00µin (0.127µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100"" (2.54mm) |
| Contact Finish - Post | - |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | Brass |