4-1571552-5
CONN IC DIP SOCKET 18POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
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TE Connectivity AMP Connectors 800 Series DIP socket, part number 4-1571552-5, offers an 18-position (2 x 9) configuration with a 0.3" (7.62mm) row spacing. This through-hole mounted component features gold plating on both mating contacts and posts, with a mating contact finish thickness of 20.0µin (0.51µm) and post contact finish thickness of 20.0µin (0.51µm), utilizing beryllium copper for mating contacts and copper for posts. The open-frame design is housed in Polycyclohexylenedimethylene Terephthalate (PCT) and Polyester materials, operating within a temperature range of -55°C to 105°C. Termination is via solder, with a pitch of 0.100" (2.54mm) at both mating and post interfaces. This component is suitable for applications in telecommunications, industrial automation, and consumer electronics. The product is supplied in tube packaging.
Additional Information
Series: 800RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | Open Frame |
| Packaging | Tube |
| Mounting Type | Through Hole |
| Type | DIP, 0.3"" (7.62mm) Row Spacing |
| Operating Temperature | -55°C ~ 105°C |
| Number of Positions or Pins (Grid) | 18 (2 x 9) |
| Termination | Solder |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Pitch - Mating | 0.100"" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100"" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 20.0µin (0.51µm) |
| Contact Material - Post | Copper |
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