382444-2
CONN SOCKET SIP 8POS TIN-LEADManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
Quality Control: Learn More
TE Connectivity AMP Connectors SIP Socket, part number 382444-2, offers an 8-position (1 x 8) through-hole mounting solution. This electronic component features a closed frame design and is constructed with a Fluoropolymer (FP) housing. The mating and post contacts are made from Beryllium Copper with a robust Tin-Lead finish, including a mating thickness of 150.0µin (3.81µm) and post thickness of 150.0µin (3.81µm). The socket operates within a temperature range of -55°C to 105°C and utilizes a solder termination method. Designed with a standard 0.100" (2.54mm) pitch for both mating and post connections, this component is suitable for various applications including telecommunications and industrial automation. It is supplied in tube packaging.
Additional Information
Series: -RoHS Status: RoHS Compliant By ExemptionManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | Closed Frame |
| Packaging | Tube |
| Mounting Type | Through Hole |
| Type | SIP |
| Operating Temperature | -55°C ~ 105°C |
| Number of Positions or Pins (Grid) | 8 (1 x 8) |
| Termination | Solder |
| Housing Material | Fluoropolymer (FP) |
| Pitch - Mating | 0.100"" (2.54mm) |
| Contact Finish - Mating | Tin-Lead |
| Contact Finish Thickness - Mating | 150.0µin (3.81µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100"" (2.54mm) |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Post | 150.0µin (3.81µm) |
| Contact Material - Post | Beryllium Copper |
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