3-1571586-6
CONN IC DIP SOCKET 24POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
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TE Connectivity AMP Connectors 3-1571586-6 is a 24-position dual-inline package (DIP) socket from the 800 series. This through-hole component features a 0.3-inch (7.62mm) row spacing and a 0.100-inch (2.54mm) pitch for both mating and post connections. The open-frame socket is constructed with a Polycyclohexylenedimethylene Terephthalate (PCT) and Polyester housing material. It utilizes beryllium copper for mating contacts and copper for post contacts, both with a gold plating offering a thickness of 25.0µin (0.63µm). The operating temperature range is -55°C to 105°C. This electronic component is suitable for applications in the industrial automation and telecommunications sectors.
Additional Information
Series: 800RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Features | Open Frame |
| Packaging | Bulk |
| Mounting Type | Through Hole |
| Type | DIP, 0.3"" (7.62mm) Row Spacing |
| Operating Temperature | -55°C ~ 105°C |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Termination | Solder |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Pitch - Mating | 0.100"" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 25.0µin (0.63µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100"" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 25.0µin (0.63µm) |
| Contact Material - Post | Copper |
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