2174988-2
CONN SOCKET LGA 2011POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
Quality Control: Learn More
TE Connectivity AMP Connectors presents a 2011-position LGA socket, surface-mount component. This open-frame socket features gold-plated copper alloy contacts, with a mating and post contact finish thickness of 30.0µin (0.76µm). The housing is constructed from thermoplastic. Designed for precision interconnectivity, this component is suitable for demanding applications across various industries including computing, networking, and high-performance computing. The socket utilizes a 0.040" (1.02mm) pitch for mating and a 0.035" (0.90mm) pitch for the post connection, terminating via solder. This component is supplied in bulk packaging.
Additional Information
Series: -RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Features | Open Frame |
| Packaging | Bulk |
| Mounting Type | Surface Mount |
| Type | LGA |
| Operating Temperature | - |
| Number of Positions or Pins (Grid) | 2011 (47 x 58) |
| Termination | Solder |
| Housing Material | Thermoplastic |
| Pitch - Mating | 0.040"" (1.02mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Material - Mating | Copper Alloy |
| Pitch - Post | 0.035"" (0.90mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) |
| Contact Material - Post | Copper Alloy |