2174988-1
CONN SOCKET LGA 2011POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
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TE Connectivity AMP Connectors' 2174988-1 is a 2011-position LGA socket designed for surface mount applications. Featuring a closed frame design, this component utilizes copper alloy contacts with a gold mating and post finish, applied at a thickness of 15.0µin (0.38µm). The thermoplastic housing ensures durability in demanding operational environments. With a mating pitch of 0.040" (1.02mm) and a post pitch of 0.035" (0.90mm), this socket is suitable for high-density interconnects. Termination is achieved via solder. This component finds application in computing, server, and networking infrastructure where reliable, high-pin-count connections are critical. This product is supplied in bulk packaging.
Additional Information
Series: -RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Features | Closed Frame |
| Packaging | Bulk |
| Mounting Type | Surface Mount |
| Type | LGA |
| Operating Temperature | - |
| Number of Positions or Pins (Grid) | 2011 (47 x 58) |
| Termination | Solder |
| Housing Material | Thermoplastic |
| Pitch - Mating | 0.040"" (1.02mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 15.0µin (0.38µm) |
| Contact Material - Mating | Copper Alloy |
| Pitch - Post | 0.035"" (0.90mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 15.0µin (0.38µm) |
| Contact Material - Post | Copper Alloy |