2-640361-4
CONN IC DIP SOCKET 24POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
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TE Connectivity AMP Connectors Diplomate DL Series 2-640361-4 is a 24-position dual-inline package (DIP) socket with a 0.6-inch row spacing, designed for through-hole mounting. This component features beryllium copper contacts with a 15.0µin gold plating on both mating and post surfaces, ensuring reliable interconnection. The closed-frame thermoplastic housing provides robust structural integrity. With a contact pitch of 0.100 inches, this socket is suitable for applications requiring secure and repeatable IC placement. It operates across a temperature range of -55°C to 125°C and is supplied in tube packaging. This component is commonly utilized in industrial automation, communications infrastructure, and test and measurement equipment.
Additional Information
Series: Diplomate DLRoHS Status: Vendor undefinedManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | Closed Frame |
| Packaging | Tube |
| Mounting Type | Through Hole |
| Type | DIP, 0.6"" (15.24mm) Row Spacing |
| Operating Temperature | -55°C ~ 125°C |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Termination | Solder |
| Housing Material | Thermoplastic |
| Pitch - Mating | 0.100"" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 15.0µin (0.38µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100"" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 15.0µin (0.38µm) |
| Contact Material - Post | Beryllium Copper |
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