1981837-2
CONN SOCKET LGA 1366POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
Quality Control: Learn More
TE Connectivity AMP Connectors LGA Socket for 1366 positions (32 x 41 array). This surface mount component features gold plated copper alloy contacts with a mating thickness of 30.0µin (0.76µm). The open frame thermoplastic housing ensures reliable performance in demanding applications. Designed for solder termination with a 0.040" (1.02mm) mating pitch. This socket is utilized across various industries including computing, telecommunications, and industrial automation where high-density interconnectivity is critical.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Features | Open Frame |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| Type | LGA |
| Operating Temperature | - |
| Number of Positions or Pins (Grid) | 1366 (32 x 41) |
| Termination | Solder |
| Housing Material | Thermoplastic |
| Pitch - Mating | 0.040"" (1.02mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Material - Mating | Copper Alloy |
| Pitch - Post | 0.040"" (1.01mm) |
| Contact Finish - Post | - |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | Copper Alloy |
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