1-1554653-1
CONN SOCKET LGA 2011POS GOLDManufacturer: TE Connectivity AMP Connectors
Categories: IC Sockets
Quality Control: Learn More
TE Connectivity AMP Connectors presents the 1-1554653-1, an LGA socket designed for high-density applications. This socket features 2011 positions arranged in a 47 x 58 grid, utilizing a surface mount termination with solder connections. The contact material is a copper alloy, finished with a robust 30.0µin (0.76µm) gold plating on both mating and post surfaces to ensure reliable conductivity and durability. The open frame design facilitates efficient heat dissipation and accessibility. Its thermoplastic housing material offers excellent thermal and electrical insulation properties. This component is suitable for demanding applications in computing, telecommunications, and industrial automation.
Additional Information
Series: -RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Features | Open Frame |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| Type | LGA |
| Operating Temperature | - |
| Number of Positions or Pins (Grid) | 2011 (47 x 58) |
| Termination | Solder |
| Housing Material | Thermoplastic |
| Pitch - Mating | - |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Material - Mating | Copper Alloy |
| Pitch - Post | - |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) |
| Contact Material - Post | Copper Alloy |
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