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TSM900N06CH X0G

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TSM900N06CH X0G

MOSFET N-CHANNEL 60V 11A TO251

Manufacturer: Taiwan Semiconductor Corporation

Categories: Single FETs, MOSFETs

Quality Control: Learn More

Taiwan Semiconductor Corporation TSM900N06CH-X0G is an N-channel MOSFET designed for power switching applications. This component features a 60V drain-source voltage (Vdss) and a continuous drain current (Id) capability of 11A at 25°C. The Rds On is specified at a maximum of 90mOhm when driven at 10V with a 6A drain current. With a maximum power dissipation of 25W (Tc), it is housed in a TO-251 (IPAK) package with through-hole mounting. Key parameters include a gate charge (Qg) of 9.3 nC and input capacitance (Ciss) of 500 pF. This MOSFET is suitable for use in automotive and industrial power management systems. The operating temperature range is -55°C to 150°C.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TubeDatasheet:
Technical Details:
PackagingTube
Package / CaseTO-251-3 Stub Leads, IPAK
Mounting TypeThrough Hole
Operating Temperature-55°C ~ 150°C (TJ)
TechnologyMOSFET (Metal Oxide)
FET TypeN-Channel
Current - Continuous Drain (Id) @ 25°C11A (Tc)
Rds On (Max) @ Id, Vgs90mOhm @ 6A, 10V
FET Feature-
Power Dissipation (Max)25W (Tc)
Vgs(th) (Max) @ Id2.5V @ 250µA
Supplier Device PackageTO-251 (IPAK)
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
Vgs (Max)±20V
Drain to Source Voltage (Vdss)60 V
Gate Charge (Qg) (Max) @ Vgs9.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds500 pF @ 15 V

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