SM671PAC-BFST
IC FLASH 512GBIT UFS3.1 153BGAManufacturer: Silicon Motion, Inc.
Categories: Memory
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Silicon Motion, Inc. presents the Ferri-UFS™ series SM671PAC-BFST, a high-performance 512Gbit Universal Flash Storage (UFS) 3.1 NAND flash memory device. This non-volatile memory component utilizes TLC NAND technology and is organized as 64G x 8. The SM671PAC-BFST features a 153-TBGA package with a 11.5x13mm footprint, suitable for surface mount applications. Operating across a temperature range of -40°C to 85°C, this component is designed for demanding applications in areas such as automotive, mobile computing, and embedded systems requiring rapid data access and storage. The UFS 3.1 interface ensures high throughput for data-intensive tasks.
Additional Information
Series: Ferri-UFS ™RoHS Status: ROHS3 CompliantManufacturer Lead Time: 14 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 153-TBGA |
| Mounting Type | Surface Mount |
| Memory Size | 512Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Supply | - |
| Technology | FLASH - NAND (TLC) |
| Memory Format | FLASH |
| Supplier Device Package | 153-BGA (11.5x13) |
| Write Cycle Time - Word, Page | - |
| Memory Interface | UFS3.1 |
| Memory Organization | 64G x 8 |
| Programmable | Not Verified |
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