SM662PEB-BDST
IC FLASH 256GBIT EMMC 153BGAManufacturer: Silicon Motion, Inc.
Categories: Memory
Quality Control: Learn More
Silicon Motion, Inc. Ferri-eMMC® SM662PEB-BDST is a 256Gbit NAND Flash memory device utilizing Triple-Level Cell (TLC) technology. This component is organized as 32 Gigabytes x 8 bits and conforms to the eMMC interface standard. The device is packaged in a 153-ball BGA with dimensions of 11.5x13mm, suitable for surface mount applications. It operates within an industrial temperature range of -40°C to 85°C. This Ferri-eMMC® solution is widely deployed in automotive infotainment, industrial control systems, and consumer electronics requiring robust and high-capacity embedded storage.
Additional Information
Series: Ferri-eMMC®RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 153-TFBGA |
| Mounting Type | Surface Mount |
| Memory Size | 256Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Supply | - |
| Technology | FLASH - NAND (TLC) |
| Memory Format | FLASH |
| Supplier Device Package | 153-BGA (11.5x13) |
| Write Cycle Time - Word, Page | - |
| Memory Interface | eMMC |
| Memory Organization | 32G x 8 |
| Programmable | Not Verified |
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