SM662PEB-BD
FERRI-EMMC BGA 153-B EMMC 3D TLCManufacturer: Silicon Motion, Inc.
Categories: Memory
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Silicon Motion, Inc. presents the SM662PEB-BD, a high-performance eMMC embedded memory solution utilizing 3D TLC NAND technology in a 153-ball BGA package. This component is engineered for robust data storage and retrieval, offering a reliable foundation for demanding applications. Its advanced architecture ensures efficient operation and data integrity, making it suitable for integration into various electronic systems. The SM662PEB-BD is designed to meet the stringent requirements of industrial control, automotive electronics, and consumer electronics markets where dependable memory performance is paramount. Its tray packaging facilitates efficient handling and integration into automated manufacturing processes.
Additional Information
Series: RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: TrayDownload Free CAD Model:
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